Introduction of epoxy resin S182

- Jan 14, 2019-

S-182 

Bis(2,3-epoxypropyl) cyclohex-4-ene-1,2-dicarboxylate

The product is equivalent to the CY183 of HUNTSMAN  

CAS No.21544-03-6


This product has a strong resistance to ultra-low temperature, and the shear strength at -253—196℃ is higher than that of the bisphenol type A epoxy resin. It has a good compatibility with other epoxy resin, and as mixing with ordinary epoxy resin it can reduce viscosity and improve performance with a large reactive activity. As taking triethylene tetramine, diaminodiphenylmethane, hexahydrophthalic anhydride as curing agent, the gel time is reduced by nearly half compared to the bisphenol type A epoxy resin; the resin possesses a good transparency, and the transparency of the product cured by m-xylene diamine at 50 ℃ / 2h is up to 81%. The resin can be used as an active thinner of epoxy adhesive to improve the process, low temperature resistance, adhesive strength, etc.