Epoxy resin has good comprehensive mechanical properties, high adhesion, small shrinkage, good stability, excellent electrical insulation properties, as a coating, adhesive, composite resin matrix, electronic packaging materials, etc. in machinery, electronics, electrical appliances Aerospace, aviation, paint, bonding and other fields have been widely used. However, since the cured epoxy resin has high crosslink density and large internal stress, it has disadvantages such as brittleness, fatigue resistance, heat resistance, and poor impact toughness, and it is difficult to meet the requirements of engineering technology, so that its application is limited. limits. In particular, it restricts the epoxy resin from being used well in composite materials such as structural materials. For this reason, domestic and foreign scholars have carried out a large number of modification studies on epoxy resins. Among them, the most important thing is to improve the brittleness and heat and humidity resistance of the epoxy resin.
The epoxy resin can be modified by chemical modification and physical methods. The chemical modification mainly consists of synthesizing a new structure of epoxy resin and a new structure of curing agent; the physical method modification mainly achieves the purpose of improving performance by forming a blend structure with the modifier. Comparing the two methods, the first method is inferior to the second method in terms of process, cost, and difficulty. Therefore, the modification of epoxy resins is currently mainly achieved by blending structures.